AES Update for new Chip Equipment Rules

Posted 12/6/24

Among other actions, the semiconductor equipment related controls announced Monday include amendments to the Temporary General Licenses (TGL) in the Export Administration Regulations (EAR).

An update has been made to AES to revise License Code C65 “Temporary General License” (TGL) permitting certain parts, components or equipment.

New controls on high-bandwidth memory units under ECCN 3A090.c, and also creates a License Exception High Bandwidth Memory (HBM).

A new License Exception Restricted Fabrication Facility (RFF)

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